LHC Cooling Working Group (CWG)
Introduction:
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A large number of electronic devices and items of equipment will be located
in and around the LHC experiments. Because space is so tight within the
detectors and there is so little space in the control rooms, special cooling
systems will be required. To get the most benefit out of the past years'experience
and cut costs, a working group was set-up in January 97 to identify common
approaches, help in standardizing some of the equipment, and select certain
firms skilled in this kind of work.
Objectives of the CWG:
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The CWG activity covers the cooling of electronics for the LHC physics
detectors and is open to all those involved in such cooling systems: members
of Collaborations, CERN technical staff, representatives from industry.
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The aims are to:
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Make an inventory of the different detector dissipators and collect specifications
(power, temperature, gradient) relating to them (a few hundred Watts overlooked
can have a disastrous effect on temperature control).
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Draw up a list of different technologies that may be envisaged for cooling
systems, together with the fluids and control systems used.
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Identify common items to manage minimum standardization.
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Draw up technical specifications for the various common elements with a
view to contacting industry (or institutes) and providing collaborations
with lists of products at the lowest possible prices.
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Initially, the CWG is not intented to examine the design of exchangers
in the detectors, which is the task of the various collaborations, but
is clearly ready to participate in any discussion which could provide technical
solutions to collaborations that so desired.
Minutes of regular CWG Meetings:
Cooling Systems and Technologies:
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Overview of cooling systems:
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Figure 5-1
Active thermal screen
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Table 6-1
Cooling methods and their applications in electronics.
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Table 6-2
Performances of cooling methods.
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Figure 6-1
Cooling methods for electronic boards and their performances.
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ECP's tests on direct cooling with power rack:
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Figure 7-1
19" Rack with direct cooling.
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Figure 7-2
ECP test rack for direct cooling (2 photos).
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Figure 7-3
Load card.
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Figure 7-4
Cooling plate.
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Figure 7-5
Cards and cooling plates.
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Figure 7-6
Air cooling effect on electronics board.
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Figure 7-7
Temperature versus cooler position.
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Figure 7-8
Influence of the cooler distance on the cooling of the card.
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Figure 7-9
Test with thermal paste (heat seal).
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Figure 7-10
Cooler pressure effect (mechanical).
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Figure 7-11
Influence of different cooling configurations on electronics board.
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Figure 7-12
Liquid cooling - Wiener power supply prototype#1
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Figure 7-13
Liquid cooling - Test set-up for power supply.
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Table 7-14
Measurements on a water cooled power supply.
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Figure 7-14
Water cooled power supply - Results on Wiener prototype#1.
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Figure 7-16
Fonctionnal scheme of the Control Unit for the RACKs LCS (PNPI - 4/06/97).
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Cooling of power cables of the detector CMS/ECAL :
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Tests and results on heat transfer of ATLAS Si - DPNC Geneva (April 97):
This page is updated by Pierre
Bonneau. Last update: 03/07/98