Table 6-1 - The cooling methods and their applications in electronics (from DATE):

For more explanations see Minutes Meeting#6 16/04/97

Heat transfer Mode
Contact
Fluid
Product
Application
1-Conduction
Direct
.
Embedded
Aluminium plate
Military boards
2-Natural convection
Direct
Air
.
Components on boards
.
.
Oil
.
Transformers
Radar
.
Indirect
Air
Heat sink
Components
Boards
Modules
. .
Water
Monophasic
thermosiphon
.
3-Forced convection
Direct
Air
.
Components
Boards
. .
Water
.
Electronical tubes
Television
. .
Freon
Fluorinert
.
Super computer
CRAY 2 and 3
.
Indirect
Air
Heat sink
Components
Boards
Systems
. .
Water
Cold plates
Electronic
cabinet
Card cage
Navy - Converters
Computers (IBM, SIEMENS)
Transmitters
. .
Oil
Coolanol
Cold plates
Electronic
cabinet
Railway
Avionic
. .
Freon
Fluorinert
Cold plates
Electronic
cabinet
omponents test systems
SCHLUMBERGER
4-Phase change
. . . .
4-1-Boiling
Direct
immer-sion
Freon
Fluorinert
Tanks
Railway converters
Boards (DOLPHIN)
Multichips modules
.
Indirect
Freon
Fluorinert
Methanol
Water
Heat pipes
Thermosiphon
Railway
Telecommunications
Varied
4-2-Latent Heat
(storage)
Indirect
Water (ice)
Paraffins
.
Petroleum industry
Spatial
5-Thermoelectricity
Direct
.
Thermoelement
Laser diodes
Optronic
.
Indirect
.
Conditioning unit
Electronic cabinets
Card cage

CERN/P.BONNEAU/30/05/97