Figure 6-1 - Cooling methods for electronic boards and their performance (from DATE):

The cold source is at 20 deg.C and the heat flux assumed to be uniformly distributed throughout.

For more explanations see Minutes Meeting#6 16/04/97

• 1-Natural convection + radiation
• 2-Forced convection 0.5 [m/s]
• 3-Forced convection 1.0 [m/s]
• 4-Forced convection 2.0 [m/s]
• 5-Forced convection 5.0 [m/s]
• 6-Forced convection 10.0 [m/s]
• 7-Passive cold plate (integrated in the card)
• 8-Passive cold plate - conduction + radiation through air gap
• 9-Passive cold plate + gap pad 1mm
• 10-Active cold plate (water flow 5[kg/h]) - conduction + radiation through air gap
• 11-Active cold plate (duct 1mm - water flow 5[kg/h]) + gap pad
• 12-Active cold plate (duct 0.5mm - water flow 10[kg/h]) + gap pad
• 13-Heat sink - forced convection (air flow 5[kg/h])
• 14-Heat sink - forced convection (air flow 10[kg/h]) + gap pad
• 15-Heat sink - forced convection (air flow 20[kg/h]) + gap pad

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CERN/P.BONNEAU/30/05/97