CWG Table 5-1

Table 5-1 - Properties of TPG and TC1050 (from Advanced Ceramics Corporation)

For more explanations see Minutes Meeting#5 19/03/97

Properties of Thermal Pyrolytic Graphite:

Heat conductivity

1700 W/mK (a & b-Axis)

25 W/mK (c-Axis)

Density

2.26 g/cm3

Coefficient of Thermal Expansion

-1.0 ppm/K (a & b-Axis)

25.0 ppm/K (c-Axis)

Thermal Diffusivity

9.8 cm2/s

Specific Heat

0.84 kJ/kg.K

Tensile Strength

1000 Ksi (a & b-Axis)

0 Ksi (c-Axis)

Depending on the material of the envelope, the TC 1050 plates had the (measured) characteristics below:

Encapsulation Material

Thermal Conductivity [W/m.K]

Mass Density [g/cm3]

Aluminium Alloy

1140

2.52

Copper

1142

4.45

AlSiC

1176

2.95

Carbon-Carbon

982

2.02

Pitch Fibre/Al

1020

2.30

Pitch Fibre/Polymer

1180

2.13

CERN/P.BONNEAU/30/05/97

Heat conductivity	1700 W/mK (a & b-Axis) 25 W/mK (c-Axis)
Density	2.26 g/cm3
Coefficient of Thermal Expansion	-1.0 ppm/K (a & b-Axis) 25.0 ppm/K (c-Axis)
Thermal Diffusivity	9.8 cm2/s
Specific Heat	0.84 kJ/kg.K
Tensile Strength	1000 Ksi (a & b-Axis) 0 Ksi (c-Axis)

Encapsulation Material	Thermal Conductivity [W/m.K]	Mass Density [g/cm3]
Aluminium Alloy	1140	2.52
Copper	1142	4.45
AlSiC	1176	2.95
Carbon-Carbon	982	2.02
Pitch Fibre/Al	1020	2.30
Pitch Fibre/Polymer	1180	2.13